TSMC achieved the production targets announced last year, but had delayed additional expansion. Recently demand has exceeded expectations, re‑affirming the need for a new 3 nm process. Accordingly, the company decided to build a 3 nm plant in advance to meet the expected increase in demand over the next few years. This move is a strategic choice to strengthen existing facilities and maximize customer manufacturing capacity.
The planned plant will be located near an industrial complex adjacent to the Seoul metropolitan area, with a total of about 100 million square meters under planning. The facility will not only accommodate ultra‑high‑density photolithography for 3 nm processes but also has the potential to expand to future advanced processes such as 2 nm and 5 nm. Construction is scheduled to complete by the end of 2027, with an initial investment estimated at about 1 trillion won.
The market reaction to TSMC’s new plant decision has been positive. With demand surging, both TSMC and Samsung Electronics have seen sales rise and share prices continue to climb. Analysts note that the high performance and low cost of the 3 nm process will trigger supply‑chain changes across the industry and strengthen technological competition. Together, TSMC is assessed as aiming to establish a leading position in the global semiconductor field through this new plant.
In conclusion, TSMP’s move to build a 3 nm plant is expected to provide a new growth engine for the industry. The company’s strategic decision and market demand forecasts appear sound, and future semiconductor competitiveness may be reshaped.